HYGROTECHENGINEERSF1D9 HYGROTECHENGINEERSF1D9 5ac7086794b1340b681b6056 False 57 36
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moisture during PCB assembly can increase the number of failures during assembly, and decrease the circuit assemblies and its life. Exposure to high moisture during Printed Circuit Board (PCB) assembly and manufacturing, leads to Microscopic corrosion Adhesion failures Surface defects Decreased performance of the circuit board. Increase electrical resistance Decrease capacitance. Hygro Desiccant Dehumidifiers provide the ideal low humidity environment in the manufacturing, assembly and storage of these precision, high quality electronic Printed Circuit Boards since they are capable of maintaining RH as low as 1% or even lower at a constant level, regardless of ambient conditions. Ref: AT & S, Mysore